Applications: Electronics

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Unpopulated and populated PCBs, misprints and ceramic substrates
Soldering frames, soldering masks and metal templates

Soil:
- Milling dust, flux residue, solder paste or SMT adhesive

Cleaning task:
- Prior to population
- After soldering
- After printing
- Prior to circuit test
- Before lacquering
- Misprints after printing

Applications: Soldering

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Soldering frames, soldering masks and metal templates

Soil:
- Milling dust, flux residue, solder paste or SMT adhesive

Cleaning task:
- Cleaning of soldering templates

Applications: Metal

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Stainless steel, steel, aluminium, copper, brass, zinc diecastings, tungsten-carbide tips

Soil:
- Cutting oils and emulsions from drilling and milling machines, polishing paste, metal particles

Cleaning task:
- As intermediate or end-of-line cleaning phase
- Before assembly or packaging
- Prior to bonding, lacquering, welding or soldering
- Before hardening
- Prior to coating (e.g. TiN and TiC)

Applications: Glassware and glass used for high-precision lenses

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Coated and uncoated glassware, e.g. moulded glass, safety glass, lenses

Soil:
- Dust, glass dust, fingerprints, particles, buffing paste and polish residue, wax

Cleaning task:
- As intermediate or end-of-line cleaning phase
- Before and after coating
- As barrier process

 Applications: Cleanrooms

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Boxes, racks, trays

Soil:
- Dust, particles, photoresist and coating residue

Cleaning task:
- For particle decontamination
- Intermediate stage or final cleaning
- before assembly or packaging
- As barrier process 
- in cleanrooms (e.g. Class 100)

Applications: Plastics

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Plastic parts, magazines and transport containers

Soil:
- Separating agents, dust, particles, oil

Cleaning task:
- Intermediate stage or final cleaning
- before assembly or packaging